Best Compound Silicone For Cpu Heatsinks

Main Features: Thermal Paste Has 5.0 W/mk Thermal Conductivity, Used To Fill The Gap Between Heating Element And The Cooling Device,Increase The Contact Area, So As To Achieve The Soundest Effect Of Thermal Conductivity, Reduce The Heat Components Operating Temperature, At The Same Time, The Thermal Paste Also Has Insulation, Non-Conductive, Wear-Resistant, Fire-Retardant, Compression, Buffering, No Damage To Metal Materials, Etc Effect. Applicable Industry: LED Industry, Automotive Electronics Industry, Power Industry, Communications Industry, Industrial Industry, Household Electrical Appliance Industry. Scope Application: Electronic Products, Motherboard, Motor,Electronic, Appliances, LED,Power Modules, Computer Host (CPU, GPU, USICS, CD-ROM, IGPT Module, Hard Drives) ,Laptop And Any Electronic Equipment Needing To Be Filled With Heat Dissipation. Why Use Thermal Compound Paste ? 1) The main purpose of the choice of Thermal Paste is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance, Thermal conductivity of Thermal Compound Paste can be good filling the gap between the contact surface; 2) because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface, And in the heat source and the radiator between the installation of thermal paste can be out of the air contact surface; 3) with thermal paste supplement, you can make the heat source and the heat sink between the contact surface better full contact, Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference. Specification: Thermal Conductivity : 5.0w/m.k. Thermal Resistance :